PALDEK INTERNATIONAL GmbH

LCP films are usually prepared through processes such as extrusion, calendering or stretching, and can be obtained in film forms of different thicknesses and sizes.It has the following characteristics:

1. High temperature stability: LCP film shows good stability under high temperature conditions and can withstand high temperature operation or application environment.
2. Low expansion coefficient: LCP film has a very low linear expansion coefficient and can maintain good dimensional stability even when temperature changes.
3. Excellent electrical properties: LCP film has excellent electrical insulation properties, low dielectric constant and low dielectric loss, making it suitable for high frequency and microwave applications.
4. Ultra-thin and flexible: LCP films can be prepared as very thin diaphragms while having good flexibility and bendability.
5. High strength and stiffness: Despite being in film form, LCP has high strength and stiffness, providing good structural support and stability.

Due to these characteristics, LCP films are widely used in electronics, communications, aerospace and other fields.It is often used to prepare high-frequency circuit boards, antenna substrates, flexible electronic products, sensors, isolation films, etc.Due to its excellent properties and diverse applications, LCP films play an important role in modern technology fields.